Electronic accessories
Intel Xeon Silver 4310 processor 2.1 GHz 18 MB Tray
Shopping information
Intel Xeon Silver 4310, Intel Xeon Silver, LGA 4189, 10 nm, Tray, Intel, 2.1 GHz
Description
Intel Xeon Silver 4310. Processor family: Intel Xeon Silver, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6.14 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel SGX: 8 GB. Processor package size: 77.5 x 56.5 mm
Specifications
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel Xeon Scalable |
| Processor base frequency | 2.1 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 120 W |
| Processor cache | 18 MB |
| Processor ARK ID | 215277 |
| Processor model | 4310 |
| Processor threads | 24 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.3 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 12 |
| Processor socket | LGA 4189 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 120 W |
| Technical details | |
| Intel Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel Hyper Threading Technology (Intel HT Technology) | Yes |
| Intel AES New Instructions (Intel AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 120 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2’21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 2 |
| Memory speed (max) | 2667 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 120 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 215277 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Speed Shift Technology | Yes |
| Intel Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel Hyper Threading Technology (Intel HT Technology) | Yes |
| Intel AES New Instructions (Intel AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel Volume Management Device (VMD) | Yes |
| Intel Optane DC Persistent Memory Supported | No |
| Intel Deep Learning Boost (Intel DL Boost) on CPU | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel Resource Director Technology (Intel RDT) | Yes |
| Intel Transactional Synchronization Extensions | Yes |
| Intel Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel SGX | 8 GB |
| Intel Platform Firmware Resilience Support | Yes |
| Intel Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 82 C |
| Packaging data | |
| Package type | Tray |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
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